Novel Porous Materials Developed for Microelectronics Thermal Management Highlighted on Front Cover of Journal of Materials Chemistry C

The microelectronics industry is moving toward miniaturization, and space limitation will be a major concern. In this work, for the first time, a novel class of ultra-light materials known as aerogels were developed and successfully integrated into electronic circuits to hinder the temperature in local hot spots and protect and shield embedded heat-sensitive micro components. This work was highlighted on the front cover of Journal of Materials Chemistry C (impact factor 8) and was selected as the most popular article of this journal. Congratulations to Omid, Zia, and Shahriar for their article “Novel, flexible, and transparent thin film polyimide aerogels with enhanced thermal insulation and high service temperature”.

https://pubs.rsc.org/en/content/articlehtml/2022/tc/d1tc06122d